SAA7113HV2 NXP Semiconductors, SAA7113HV2 Datasheet - Page 72
SAA7113HV2
Manufacturer Part Number
SAA7113HV2
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SAA7113HV2.pdf
(75 pages)
Specifications of SAA7113HV2
Video Resolution (max)
720Pixels
Pin Count
44
Package Type
PQFP
Lead Free Status / RoHS Status
Compliant
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Philips Semiconductors
19. Revision history
Table 82:
9397 750 14232
Product data sheet
Document ID
SAA7113H_2
Modifications:
SAA7113H_1
Revision history
Release date
20050509
19990701
•
•
•
•
•
[4]
[5]
[6]
[7]
[8]
[9]
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
Table
Table
added
Table
Table
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
3: Changed description of pins 23 and 24.
77: Thermal resistance from junction to ambient: changed value from 64 K/W to 53 K/W,
78, Digital inputs, input leakage current: changed maximum value from 10 A to 1 A.
78, Digital inputs, I/O leakage current: added maximum value of 10 A.
Table note 1
Data sheet status
Product data sheet
Product specification
Rev. 02 — 9 May 2005
Change notice
-
-
Doc. number
9397 750 14232
9397 750 04567
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
9-bit video input processor
SAA7113H
Supersedes
SAA7113H_1
-
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