ISL1209IU10Z Intersil, ISL1209IU10Z Datasheet - Page 22

• Manufacturer Part Number: ISL1209IU10Z
• Description: IC RTC LP BATT BACK SRAM 10MSOP
• Manufacturer: Intersil
• Type: Clock/Calendar/NVSRAMr

Specifications of ISL1209IU10Z

• Memory Size: 2B
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

If full industrial temperature compensation is desired in an
ISL1209 circuit, then both the DTR and ATR registers will
need to be utilized (total correction range = -94 to +140ppm).
A system to implement temperature compensation would
consist of the ISL1209, a temperature sensor, and a
microcontroller. These devices may already be in the system
so the function will just be a matter of implementing software
and performing some calculations. Fairly accurate
temperature compensation can be implemented just by
using the crystal manufacturer’s specifications for the
turnover temperature T
formula for calculating the oscillator adjustment necessary
is:
Adjustment (ppm) = (T – T
Once the temperature curve for a crystal is established, then
the designer should decide at what discrete temperatures
the compensation will change. Since drift is higher at
extreme temperatures, the compensation may not be
needed until the temperature is greater than 20°C from T
A sample curve of the ATR setting vs. Frequency Adjustment
for the ISL1209 and a typical RTC crystal is given in Figure
19. This curve may vary with different crystals, so it is good
practice to evaluate a given crystal in an ISL1209 circuit
before establishing the adjustment values.
This curve is then used to figure what ATR and DTR settings
are used for compensation. The results would be placed in a
lookup table for the microcontroller to access.
Layout Considerations
The crystal input at X1 has a very high impedance, and
oscillator circuits operating at low frequencies such as
32.768kHz are known to pick up noise very easily if layout
precautions are not followed. Most instances of erratic
clocking or large accuracy errors can be traced to the
susceptibility of the oscillator circuit to interference from
adjacent high speed clock or data lines. Careful layout of the
RTC circuit will avoid noise pickup and insure accurate
clocking.
FIGURE 19. ATR SETTING vs OSCILLATOR FREQUENCY
-10.0
-20.0
-30.0
-40.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
0
ADJUSTMENT
5
10 15 20 25 30 35 40 45 50 55 60
0
and the drift coefficient (β). The
0
ATR SETTING
)
2
22
* β
0
.
ISL1209
Figure 20 shows a suggested layout for the ISL1209 device
using a surface mount crystal. Two main precautions should
be followed:
Do not run the serial bus lines or any high speed logic lines
in the vicinity of the crystal. These logic level lines can
induce noise in the oscillator circuit to cause misclocking.
Add a ground trace around the crystal with one end
terminated at the chip ground. This will provide termination
for emitted noise in the vicinity of the RTC device.
In addition, it is a good idea to avoid a ground plane under
the X1 and X2 pins and the crystal, as this will affect the load
capacitance and therefore the oscillator accuracy of the
circuit. If the ~IRQ/F
routed away from the RTC device as well. The traces for the
V
be routed around the crystal.
Super Capacitor Backup
The ISL1209 device provides a V
battery backup input. A Super Capacitor can be used as an
alternative to a battery in cases where shorter backup times
are required. Since the battery backup supply current
required by the ISL1209 is extremely low, it is possible to get
months of backup operation using a Super Capacitor.
Typical capacitor values are a few µF to 1 Farad or more
depending on the application.
If backup is only needed for a few minutes, then a small
inexpensive electrolytic capacitor can be used. For extended
periods, a low leakage, high capacity Super Capacitor is the
best choice. These devices are available from such vendors
as Panasonic and Murata. The main specifications include
working voltage and leakage current. If the application is for
charging the capacitor from a +5V ±5% supply with a signal
diode, then the voltage on the capacitor can vary from ~4.5V
to slightly over 5.0V. A capacitor with a rated WV of 5.0V
may have a reduced lifetime if the supply voltage is slightly
high. The leakage current should be as small as possible.
For example, a Super Capacitor should be specified with
leakage of well below 1µA. A standard electrolytic capacitor
with DC leakage current in the microamps will have a
severely shortened backup time.
BAT
FIGURE 20. SUGGESTED LAYOUT FOR ISL1209 AND
and VDD pins can be treated as a ground, and should
CRYSTAL
OUT
pin is used as a clock, it should be
BAT
pin which is used for a
October 17, 2006
FN6109.4