DS1302Z+ Maxim Integrated Products, DS1302Z+ Datasheet - Page 5

• Manufacturer Part Number: DS1302Z+
• Description: IC TIMEKEEPER W/CHARGER 8-SOIC
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/Trickle-Chargerr

Specifications of DS1302Z+

• Memory Size: 31B
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: 3-Wire Serial
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Function: Clock/Calendar/Trickle Charger/NV Timekeeping RAM
• Rtc Memory Size: 31 Byte
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Rtc Bus Interface: Serial (3-Wire)
• Supply Current: 1.2 mA
• Clock Format: HH
• Clock Ic Type: RTC
• Ic Interface Type: 3 Wire
• Memory Configuration: 31 X 8
• Supply Voltage Range: 2V To 5.5V
• Digital Ic Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

OSCILLATOR CIRCUIT
The DS1302 uses an external 32.768kHz crystal. The oscillator circuit does not require any external resistors or
capacitors to operate. Table 1 specifies several crystal parameters for the external crystal. Figure 1 shows a
functional schematic of the oscillator circuit. If using a crystal with the specified characteristics, the startup time is
usually less than one second.
CLOCK ACCURACY
The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match between
the capacitive load of the oscillator circuit and the capacitive load for which the crystal was trimmed. Additional
error will be added by crystal frequency drift caused by temperature shifts. External circuit noise coupled into the
oscillator circuit may result in the clock running fast. Figure 2 shows a typical PC board layout for isolating the
crystal and oscillator from noise. Refer to Application Note 58: Crystal Considerations for Dallas Real-Time Clocks
for detailed information.
Table 1. Crystal Specifications*
*The crystal, traces, and crystal input pins should be isolated from RF generating signals. Refer to
Application Note 58: Crystal Considerations for Dallas Real-Time Clocks for additional specifications.
Figure 2. Typical PC Board Layout for Crystal
COMMAND BYTE
Figure 3 shows the command byte. A command byte initiates each data transfer. The MSB (bit 7) must be a logic
1. If it is 0, writes to the DS1302 will be disabled. Bit 6 specifies clock/calendar data if logic 0 or RAM data if logic 1.
Bits 1 to 5 specify the designated registers to be input or output, and the LSB (bit 0) specifies a write operation
(input) if logic 0 or read operation (output) if logic 1. The command byte is always input starting with the LSB (bit 0).
Figure 3. Address/Command Byte
Nominal Frequency
Series Resistance
Load Capacitance
PARAMETER
LOCAL GROUND PLANE (LAYER 2)
7
1
CRYSTAL
RAM
C K
6
SYMBOL
ESR
C
f
O
L
A4
5
GND
X1
X2
MIN
A3
32.768
4
TYP
6
5 of 13
NOTE: AVOID ROUTING SIGNALS IN THE
CROSSHATCHED AREA (UPPER LEFT-
HAND QUADRANT) OF THE PACKAGE
UNLESS THERE IS A GROUND PLANE
BETWEEN THE SIGNAL LINE AND THE
PACKAGE.
MAX
A2
3
45
UNITS
kHz
kΩ
pF
A1
2
A0
1
W R
RD
0