AD9277BSVZ Analog Devices Inc, AD9277BSVZ Datasheet - Page 10

• Manufacturer Part Number: AD9277BSVZ
• Description: IC ADC 14BIT LNA/VGA/AAF 100TQFP
• Manufacturer: Analog Devices Inc
• Type: Ultrasound Receiversr

Specifications of AD9277BSVZ

• Resolution (bits): 14 b
• Data Interface: Serial, SPI™
• Sampling Rate (per Second): 10M ~ 50M
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 1.8V, 3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
• Sampling Rate: 50MSPS
• Input Channel Type: Single Ended
• Supply Voltage Range - Digital: 1.7V To 1.9V
• Supply Current: 365mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9277
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD1 to GND
AVDD2 to GND
DRVDD to GND
GND to GND
AVDD2 to AVDD1
AVDD1 to DRVDD
AVDD2 to DRVDD
Digital Outputs (DOUTx+, DOUTx−,
CLK+, CLK−, SDIO to GND
LI-x, LO-x, LOSW-x to GND
CWI−, CWI+, CWQ−, CWQ+ to GND
PDWN, STBY, SCLK, CSB to GND
GAIN+, GAIN−, RESET, 4LO+, 4LO−,
RBIAS, VREF to GND
Operating Temperature Range (Ambient)
Storage Temperature Range (Ambient)
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
DCO+, DCO−, FCO+, FCO−) to GND
GPO0, GPO1, GPO2, GPO3 to GND
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +3.9 V
−2.0 V to +2.0 V
−2.0 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
Rev. 0 | Page 10 of 48
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Airflow Velocity (m/s)
0.0
1.0
2.5
1
ESD CAUTION
θ
soldered to PCB.
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
θ
20.3
14.4
12.9
JA
1
θ
7.6
JB
θ
4.7
JC
Unit
°C/W
°C/W
°C/W