ADN2850BCP250 Analog Devices Inc, ADN2850BCP250 Datasheet - Page 25
ADN2850BCP250
Manufacturer Part Number
ADN2850BCP250
Description
IC DGTL RHEO DL 1024POS 16LFCSP
Manufacturer
Analog Devices Inc
Specifications of ADN2850BCP250
Taps
1024
Resistance (ohms)
250K
Number Of Circuits
2
Temperature Coefficient
35 ppm/°C Typical
Memory Type
Non-Volatile
Interface
4-Wire SPI Serial
Voltage - Supply
3 V ~ 5.5 V, ±2.25 V ~ 2.75 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-LFCSP
Resistance In Ohms
250K
Number Of Elements
2
# Of Taps
1024
Resistance (max)
250KOhm
Power Supply Requirement
Single/Dual
Interface Type
Serial (4-Wire/SPI)
Single Supply Voltage (typ)
5V
Dual Supply Voltage (typ)
±2.5V
Single Supply Voltage (min)
3V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
±2.25V
Dual Supply Voltage (max)
±2.75V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
EVAL-ADN2850-25EBZ - BOARD EVALUATION FOR ADN2850-25
Lead Free Status / RoHS Status
Not Compliant, Contains lead / RoHS non-compliant
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADN2850BRUZ25
ADN2850BRUZ25-RL7
ADN2850BCPZ25
ADN2850BCPZ25-RL7
ADN2850BCPZ250
ADN2850BCPZ250-RL7
EVAL-ADN2850SDZ
1
Z = RoHS Compliant Part.
1
INDICATOR
1.00
0.85
0.80
PIN 1
12° MAX
SEATING
PLANE
0.15
0.05
R
25
25
25
25
250
250
4.50
4.40
4.30
PIN 1
WB
(kΩ)
BSC SQ
BSC
0.65
VIEW
5.00
TOP
16
Figure 44. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.80 MAX
0.65 TYP
Figure 45. 16-Lead Thin Shrink Small Outline Package [TSSOP]
COMPLIANT TO JEDEC STANDARDS MO-220-VHHB
1
COPLANARITY
0.35
0.30
0.25
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
BSC SQ
0.20 REF
0.30
0.19
Dimensions shown in millimeters
Dimensions shown in millimeters
4.75
5 × 5 mm Body, Very Thin Quad
9
8
1.20
MAX
0.05 MAX
0.02 NOM
Rev. C | Page 25 of 28
COPLANARITY
SEATING
PLANE
BSC
6.40
(CP-16-6)
0.80 BSC
0.60 MAX
(RU-16)
0.08
0.20
0.09
0.75
0.60
0.50
12
9
13
8
(BOTTOM VIEW)
8°
0°
EXPOSED
2.40 BSC
Package Description
16-Lead TSSOP
16-Lead TSSOP
16-Lead LFCSP_VQ
16-Lead LFCSP
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
Evaluation Board
0.60 MAX
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
16
5
1
4
0.25 MIN
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.75
0.60
0.45
Package Option
RU-16
RU-16
CP-16-6
CP-16-6
CP-16-6
CP-16-6
ADN2850