AD9772AASTZ Analog Devices Inc, AD9772AASTZ Datasheet - Page 9
![IC DAC 14BIT 160MSPS 48-LQFP](/photos/6/59/65923/505-48-lqfp_sml.jpg)
AD9772AASTZ
Manufacturer Part Number
AD9772AASTZ
Description
IC DAC 14BIT 160MSPS 48-LQFP
Manufacturer
Analog Devices Inc
Series
TxDAC+®r
Datasheet
1.AD9772AASTZ.pdf
(40 pages)
Specifications of AD9772AASTZ
Data Interface
Parallel
Settling Time
11ns
Number Of Bits
14
Number Of Converters
1
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
272mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-LQFP
Resolution (bits)
14bit
Sampling Rate
160MSPS
Input Channel Type
Parallel
Supply Voltage Range - Analog
3.1V To 3.5V
Supply Current
37mA
Digital Ic Case Style
QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9772A-EB - BOARD EVAL FOR AD9772A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
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Manufacturer
Quantity
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Manufacturer:
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Company:
Part Number:
AD9772AASTZRL
Manufacturer:
Analog Devices Inc
Quantity:
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Part Number:
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ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD, DVDD, CLKVDD,
AVDD, DVDD, CLKVDD,
ACOM, DCOM,
REFIO, REFLO, FSADJ,
I
DB0 to DB13, MOD0,
CLK+, CLK−
DIV0, DIV1, RESET
LPF
Junction Temperature
Storage Temperature
Lead Temperature
OUTA
PLLVDD
PLLVDD
CLKCOM, PLLCOM
SLEEP
MOD1, PLLLOCK
(10 sec)
, I
OUTB
With Respect to
ACOM, DCOM,
CLKCOM, PLLCOM
AVDD, DVDD,
CLKVDD, PLLVDD
ACOM, DCOM,
CLKCOM, PLLCOM
ACOM
ACOM
DCOM
CLKCOM
CLKCOM
PLLCOM
Rating
−0.3 V to +4.0 V
−4.0 V to +4.0 V
−0.3 V to +0.3 V
−0.3 V to
AVDD + 0.3 V
−1.0 V to
AVDD + 0.3 V
−0.3 V to
DVDD + 0.3 V
−0.3 V to
CLKVDD + 0.3 V
−0.3 V to
CLKVDD + 0.3 V
−0.3 V to
PLLVDD + 0.3 V
125°C
−65°C to +150°C
300°C
Rev. C | Page 9 of 40
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
θ
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
48-Lead LQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
91
JA
θ
28
JC
AD9772A
Unit
°C/W