MAX5550ETE+ Maxim Integrated Products, MAX5550ETE+ Datasheet - Page 2

• Manufacturer Part Number: MAX5550ETE+
• Description: IC DAC 10BIT DUAL 30MA 16-TQFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX5550ETE+

• Settling Time: 30µs
• Number Of Bits: 10
• Data Interface: Serial
• Number Of Converters: 2
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TQFN Exposed Pad
• Conversion Rate: 10 MSPs
• Resolution: 10 bit
• Interface Type: Serial (SPI, I2C)
• Supply Voltage (max): 5.25 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Supply Current: 6 mA
• Voltage Reference: Internal
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
OUTA, OUTB to GND .................................-0.3V to (V
REFIN,
SCLK/SCL, DIN/SDA ................................................-0.3V to +6V
Continuous Power Dissipation (T
Dual, 10-Bit, Programmable, 30mA
High-Output-Current DAC
ELECTRICAL CHARACTERISTICS
(V
V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
STATIC PERFORMANCE—ANALOG SECTION
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset
Zero-Scale Error
Full-Scale Error
REFERENCE
Internal Reference Range
Internal Reference Tempco
External Reference Range
External Reference Input Current
DAC OUTPUTS
Full-Scale Current
Output Current Leakage in
Shutdown
Output Capacitance
Current Source Dropout Voltage
(V
Output Impedance at Full-Scale
Current
Capacitive Load to Ground
Series Inductive Load
Maximum FSADJ_ Capacitive
Load
DYNAMIC PERFORMANCE
Settling Time
Digital Feedthrough
DD
SCLK/SCL
16-Pin Thin QFN (derate 17.5mW/°C above +70°C) ..1398.6mW
FSADJB to GND ......................................-0.3V to (V
DD
DD
_______________________________________________________________________________________
to GND .............................................................-0.3V to +6V
= +2.7V to +5.25V, GND = 0, V
- V
CS/AO, DOUT/AI, SPI/I2C, FSADJA,
OUT
PARAMETER
= 0, T
_)
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
A
= +85°C)
SYMBOL
C
C
L
REFIN
FSADJ_
DNL
LOAD
LOAD
INL
I
OS
t
S
= +1.25V, internal reference, R
I
Guaranteed monotonic
I
I
includes offset
(Note 3)
I
I
C
OUT
OUT
OUT
OUT
OUT
LOAD
DD
DD
_ = 1mA to 30mA (Note 2)
_ = 1mA to 30mA, code = 0x000
_ = 1mA to 30mA, code = 0x3FF,
_ = 30mA
_ = 20mA
+ 0.3V)
+ 0.3V)
= 24pF, L
CONDITIONS
LOAD
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
T
T
= 27nH (Note 4)
A
A
= +25°C
= -40°C to +85°C
FSADJ_
DD
= 20kΩ; compliance voltage = (V
= +3.0V and T
MIN
1.21
0.55
-50
0.5
0.6
10
1
1
A
= +25°C.) (Note 1)
TYP
1.25
108
100
100
-16
-16
±2
30
10
10
75
30
2
MAX
1.29
225
1.5
±1
±1
30
1
DD
ppm/°C
UNITS
- 0.6V),
LSB
LSB
LSB
LSB
Bits
nVs
mA
µA
µA
µA
pF
kΩ
nH
pF
nF
µs
V
V
V