LTC2634IMSE-HZ12#TRPBF Linear Technology, LTC2634IMSE-HZ12#TRPBF Datasheet - Page 23

IC DAC 12BIT QUAD 2.5V 10-MSOP

LTC2634IMSE-HZ12#TRPBF

Manufacturer Part Number
LTC2634IMSE-HZ12#TRPBF
Description
IC DAC 12BIT QUAD 2.5V 10-MSOP
Manufacturer
Linear Technology
Datasheet

Specifications of LTC2634IMSE-HZ12#TRPBF

Settling Time
4.2µs
Number Of Bits
12
Data Interface
MICROWIRE™, Serial, SPI™
Number Of Converters
4
Voltage Supply Source
Single Supply
Power Dissipation (max)
1.8mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
10-MSOP Exposed Pad, 10-HMSOP, 10-eMSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC2634IMSE-HZ12#TRPBFLTC2634IMSE-HZ12
Manufacturer:
LT
Quantity:
10 000
operation
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is limited
to voltages within the supply range.
Since the analog output of the DAC cannot go below ground,
it may limit for the lowest codes as shown in Figure 4b.
Similarly, limiting can occur near full-scale when the REF
pin is tied to V
(FSE) is positive, the output for the highest codes limits
at V
occur if V
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.
Board Layout
The PC board should have separate areas for the analog and
digital sections of the circuit. A single, solid ground plane
should be used, with analog and digital signals carefully
routed over separate areas of the plane. This keeps digital
signals away from sensitive analog signals and minimizes
the interaction between digital ground currents and the
analog section of the ground plane. The resistance from
CC
, as shown in Figure 4c. No full-scale limiting can
REF
is less than V
CC
. If V
REF
= V
CC
CC
and the DAC full-scale error
– FSE.
the LTC2634 GND pin to the ground plane should be as
low as possible. Resistance here will add directly to the
effective DC output impedance of the device (typically
0.1Ω). Note that the LTC2634 is no more susceptible to
this effect than any other parts of this type; on the con-
trary, it allows layout-based performance improvements
to shine rather than limiting attainable performance with
excessive internal resistance.
Another technique for minimizing errors is to use a sepa-
rate power ground return trace on another board layer.
The trace should run between the point where the power
supply is connected to the board and the DAC ground pin.
Thus the DAC ground pin becomes the common point for
analog ground, digital ground, and power ground. When
the LTC2634 is sinking large currents, this current flows
out the ground pin and directly to the power ground trace
without affecting the analog ground plane voltage.
It is sometimes necessary to interrupt the ground plane
to confine digital ground currents to the digital portion of
the plane. When doing this, make the gap in the plane only
as long as it needs to be to serve its purpose and ensure
that no traces cross over the gap.
LTC2634

2634fc

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