LTC2634IMSE-HZ12#TRPBF Linear Technology, LTC2634IMSE-HZ12#TRPBF Datasheet - Page 27

IC DAC 12BIT QUAD 2.5V 10-MSOP

LTC2634IMSE-HZ12#TRPBF

Manufacturer Part Number
LTC2634IMSE-HZ12#TRPBF
Description
IC DAC 12BIT QUAD 2.5V 10-MSOP
Manufacturer
Linear Technology
Datasheet

Specifications of LTC2634IMSE-HZ12#TRPBF

Settling Time
4.2µs
Number Of Bits
12
Data Interface
MICROWIRE™, Serial, SPI™
Number Of Converters
4
Voltage Supply Source
Single Supply
Power Dissipation (max)
1.8mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
10-MSOP Exposed Pad, 10-HMSOP, 10-eMSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC2634IMSE-HZ12#TRPBFLTC2634IMSE-HZ12
Manufacturer:
LT
Quantity:
10 000
package Description
3.50 0.05
2.10 0.05
1.45 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
3.00 0.10
(4 SIDES)
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.50 BSC
0.25 0.05
0.70 0.05
PACKAGE OUTLINE
0.75 0.05
UD Package
1.45 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
0.50 BSC
0.25 0.05
1
2
(UD16) QFN 0904
0.40 0.10
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 45 CHAMFER
LTC2634

2634fc

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