MT4JTF12864AZ-1G4D1 Micron Technology Inc, MT4JTF12864AZ-1G4D1 Datasheet - Page 9

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MT4JTF12864AZ-1G4D1

Manufacturer Part Number
MT4JTF12864AZ-1G4D1
Description
MOD DDR3 SDRAM 1GB 240UDIMM
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT4JTF12864AZ-1G4D1

Main Category
DRAM Module
Sub-category
DDR3 SDRAM
Module Type
240UDIMM
Device Core Size
64b
Organization
128Mx64
Total Density
1GByte
Maximum Clock Rate
1.333GHz
Operating Supply Voltage (typ)
1.5V
Operating Current
1.34A
Number Of Elements
4
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Memory Type
DDR3 SDRAM
Memory Size
1GB
Speed
1333MT/s
Features
-
Package / Case
240-UDIMM
Lead Free Status / Rohs Status
Compliant
Electrical Specifications
Table 8: Absolute Maximum Ratings
Table 9: Operating Conditions
PDF: 09005aef83cad6ed
JTF4C64_128x64AZ.pdf – Rev. A 10/09
V
V
Symbol
REFDQ(DC)
REFCA(DC)
I
V
I
V
VREF
I
VTT
T
T
V
OZ
Symbol
I
DD
TT
A
I
C
IN
V
, V
DD
OUT
Parameter
V
Input reference voltage command/address
bus
I/O reference voltage DQ bus
Termination reference current from V
Termination reference voltage (DC) – com-
mand/address bus
Input leakage current; Any in-
put 0V ≤ V
put 0V ≤ V
other pins not under test =
0V)
Output leakage current; 0V ≤
V
are disabled; ODT is HIGH
V
or V
test = 0V)
Module ambient operating temperature
DDR3 SDRAM component case operating
temperature
DD
OUT
REF
REFCA
supply voltage
supply leakage current; V
≤ V
Parameter
V
Voltage on any pin relative to V
DD
DDQ
= V
Notes:
IN
IN
supply voltage relative to V
; DQ and ODT
≤ V
≤ 0.95V (All
DD
/2 (All other pins not under
DD
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in each device’s data sheet is not implied. Exposure to
absolute maximum rating conditions for extended periods may adversely affect reliability.
; V
1. V
2. T
3. For further information, refer to technical note TN-00-08: ”Thermal Applications,” avail-
4. The refresh rate is required to double when 85°C < T
REF
and address signals’ voltage margin and will reduce timing margins.
able on Micron’s Web site.
A
TT
in-
and T
termination voltage in excess of the stated limit will adversely affect the command
REFDQ
C
Address in-
puts, RAS#,
CAS#, WE#,
BA, S#, CKE,
ODT, CK, CK#
DM
DQ, DQS,
DQS#
are simultaneous requirements.
512MB, 1GB (x64, SR) 240-Pin DDR3 SDRAM UDIMM
= V
TT
SS
SS
DD
/2
0.49 × V
9
0.49 × V
0.49 × V
1.425
–600
Min
–8
–2
–5
–4
DD
0
0
- 20mV 0.5 × V
DD
DD
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Min
–0.4
–0.4
0.5 × V
0.5 × V
Nom
1.5
0
0
0
0
DD
DD
DD
C
0.51 × V
Electrical Specifications
≤ 95°C.
+1.975
+1.975
0.51 × V
0.51 × V
Max
1.575
Max
+600
+70
+85
©2009 Micron Technology, Inc. All rights reserved.
DD
+8
+2
+5
+4
+ 20mV
DD
DD
Units Notes
mA
µA
µA
µA
°C
°C
V
V
V
V
Units
V
V
2, 3, 4
2, 3
1

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