RG82865GV S L77X Intel, RG82865GV S L77X Datasheet - Page 209

• Manufacturer Part Number: RG82865GV S L77X
• Manufacturer: Intel

Specifications of RG82865GV S L77X

• Lead Free Status / Rohs Status: Not Compliant

7.2
Intel
®
Figure 18. Intel
82865G/82865GV GMCH Datasheet
GMCH Package Information
The GMCH is in a 37.5 mm x 37.5 mm Flip Chip Ball Grid Array (FC-BGA) package with 932 solder balls.
Figure 18
ϕ 0.6500 ±0.05
Units = Millimeters
®
ϕ 0.500
82865G GMCH Package Dimensions (Top and Side Views)
and
37.50 ±0.05
Figure 19
0.203
Detail A
18.75 17.9250
C
A
show the package dimensions.
16.9500
Detail B
Detail A
B
0.500 ±0.070
ϕ 1.1500 ±0.05
ϕ 1.00
0.203
Detail B
Substrate
17.9250
16.9500
C
A
B
37.50 ±0.050
Top View
0.57 ±0.1
3 x 0.07
Side View
Detail C
Die
Ballout and Package Information
18.75
0.57 ±0.1
1.5 ±0.05
See Detail D
0.74 ±0.025
0.100 ±0.025
Detail D
Detail A
Detail C
1.08 ±0.06
A
Die Solder
Bumps
0.200
Underfill
Pk
Epoxy
60 Sid T
209