PF38F5060M0Y0CFB Micron Technology Inc, PF38F5060M0Y0CFB Datasheet - Page 16
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
PF38F5060M0Y0CFB
Manufacturer Part Number
PF38F5060M0Y0CFB
Description
Manufacturer
Micron Technology Inc
Datasheet
1.PF38F5060M0Y0CFB.pdf
(102 pages)
Specifications of PF38F5060M0Y0CFB
Operating Supply Voltage (max)
1.95V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / Rohs Status
Compliant
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4.0
4.1
Figure 4:
Datasheet
16
Notes:
1.
2.
A
B
C
D
E
F
G
VCCQ
On lower density devices, upper address balls can be treated as NC.; for example, 32-Mbit density, A21 and A22 are NC).
See
1
VSS
DQ7
A11
A12
A13
A15
Section 3.0, “Package Information” on page 13
56-Ball VF BGA Ballout
VSSQ
DQ15
DQ14
2
A10
A14
A8
A9
Complete Ink Mark Not Shown
Ballout and Signal Descriptions
Signal Ballout
The W18 device is available in a 56-ball VF BGA and µBGA Chip Scale Package with
0.75 mm ball pitch, or the 88-ball (80 active balls) QUAD+ SCSP package.
shows the device ballout for the VF BGA package.
the QUAD+ package.
Top View - Ball Side Down
WAIT
DQ13
VSS
DQ6
DQ5
A20
A21
3
ADV#
DQ11
VCC
CLK
DQ4
VCC
A16
4
RST#
DQ12
DQ10
WE#
DQ2
DQ3
VPP
5
VCCQ
WP#
DQ1
DQ9
A18
A17
A19
6
CE#
DQ0
DQ8
A22
A6
A5
A7
7
VSSQ
OE#
A4
A3
A2
A1
A0
8
VSSQ
8
OE#
A4
A3
A2
A1
A0
for mechanical specifications for the package.
7
CE#
DQ0
DQ8
A22
A6
A5
A7
VCCQ
Figure 5
WP#
DQ1
DQ9
A18
A17
A19
6
Numonyx™ Wireless Flash Memory (W18)
Numonyx™ Wireless Flash Memory (W18)
Bottom View - Ball Side Up
RST#
DQ12
DQ10
WE#
5
VPP
DQ2
DQ3
shows the device ballout for
ADV#
DQ11
VCC
DQ4
VCC
4
CLK
A16
Order Number: 290701-18
WAIT
DQ13 DQ14
3
VSS
DQ6
DQ5
A20
A21
VSSQ
DQ15
A10
A14
2
A8
A9
November 2007
Figure 4
VCCQ
VSS
DQ7
A11
A12
A13
A15
1
A
B
C
D
E
F
G
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