BOXD845EBG2L Intel, BOXD845EBG2L Datasheet - Page 30

• Manufacturer Part Number: BOXD845EBG2L
• Manufacturer: Intel

Specifications of BOXD845EBG2L

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Intel Desktop Board D845EBG2/D845EPT2 Technical Product Specification
1.10 Audio Subsystem (Optional)
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The audio subsystem consists of the following devices:
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The audio subsystem includes these features:
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The audio subsystem supports the following audio interfaces:
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Figure 6 is a block diagram of the audio subsystem.
For information about
Upgrading the onboard audio subsystem using a CNR audio card
The front panel audio connector
The optional back panel audio connectors
Intel 82801DB I/O Controller Hub (ICH4)
Analog Devices AD1981A audio codec (optional)
Split digital/analog architecture for improved S/N (signal-to-noise) ratio: ≥ 85 dB
Power management support for ACPI 2.0 (driver dependant)
Mic in pre-amp that supports dynamic, condenser, and electret microphones
ATAPI-style connectors:
 Auxiliary line in
 CD-ROM
Front panel audio connector, including pins for:
 Line out
 Mic in
Back panel audio connectors (optional):
 Line out
 Line in
 Mic in
I/O Controller Hub
82801DB
(ICH4)
Figure 6. Audio Subsystem Block Diagram
AC ’97
Link
Audio Codec
AD1981A
Auxiliary Line In
Refer to
Section 1.12, page 33
Section 2.8.3, page 70
Section 2.8.1, page 54
CD-ROM
Line Out
Mic In
Line In
OM14261