BOXD845EBG2L Intel, BOXD845EBG2L Datasheet - Page 83

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BOXD845EBG2L

Manufacturer Part Number
BOXD845EBG2L
Description
Manufacturer
Intel
Datasheet

Specifications of BOXD845EBG2L

Lead Free Status / Rohs Status
Supplier Unconfirmed
2.11.5 Power Supply Considerations
2.12 Thermal Considerations
CAUTION
The +5 V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options. Refer to
Section 2.11.3 on page 80 for additional information.
System integrators should refer to the power usage values listed in Table 49 when selecting a
power supply for use with the Desktop Board D845EBG2 or D845EPT2.
Measurements account only for current sourced by the Desktop Board D845EBG2 or D845EPT2
while running in idle modes of the started operating systems.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification.
CAUTION
Ensure that the ambient temperature does not exceed the Desktop Board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 2.14.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item A in Figure 21) can reach a temperature of up to 85
For information about
The ATX form factor specification
The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
The current capability of the +5 VSB line (Section 4.2.1.2)
All timing parameters (Section 4.2.1.3)
All voltage tolerances (Section 4.2.2)
o
C in an open chassis.
Refer to
Section 1.5, page 18
Technical Reference
83