TDA8552T/N1.512 NXP Semiconductors, TDA8552T/N1.512 Datasheet - Page 24

• Manufacturer Part Number: TDA8552T/N1.512
• Manufacturer: NXP Semiconductors

Specifications of TDA8552T/N1.512

• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Headphone/Speaker
• Single Supply Voltage (typ): 5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 2.2W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2002 Jan 04
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
24
not suitable
suitable
not recommended
not recommended
not suitable
WAVE
TDA8552T; TDA8552TS
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
(1)