C8051F336-GMR Silicon Laboratories Inc, C8051F336-GMR Datasheet - Page 24
C8051F336-GMR
Manufacturer Part Number
C8051F336-GMR
Description
Microcontrollers (MCU) 16KB 10ADC 10DAC 768Ram MCU Lead Free
Manufacturer
Silicon Laboratories Inc
Datasheet
1.C8051F336-GM.pdf
(226 pages)
Specifications of C8051F336-GMR
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Data Ram Size
768 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QFN-20
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F336DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
On-chip Dac
10 bit
Package
20QFN
Device Core
8051
Family Name
C8051F336
Maximum Speed
25 MHz
Ram Size
768 Byte
Operating Temperature
-40 to 85 °C
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F336-GMR
Manufacturer:
SILICON
Quantity:
100
Part Number:
C8051F336-GMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60μm minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (71% Paste Coverage).
Small Body Components.
Figure 4.2. QFN-20 Recommended PCB Land Pattern
Table 4.2. QFN-20 PCB Land Pattern Dimesions
0.20
Min
3.70
3.70
0.50
0.30
Max
Rev.1.0
Dimension
X2
Y1
Y2
2.15
0.90
2.15
Min
Max
2.25
1.00
2.25
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