AD5382BST-3 Analog Devices Inc, AD5382BST-3 Datasheet - Page 8
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AD5382BST-3
Manufacturer Part Number
AD5382BST-3
Description
IC DAC 14BIT 32CH 3V 100-LQFP
Manufacturer
Analog Devices Inc
Datasheet
1.AD5382BSTZ-5.pdf
(40 pages)
Specifications of AD5382BST-3
Design Resources
32 Channels of Programmable Voltage with Excellent Temperature Drift Performance Using AD5382 (CN0011) AD5382 Channel Monitor Function (CN0012)
Settling Time
8µs
Number Of Bits
14
Data Interface
Serial, Parallel
Number Of Converters
32
Voltage Supply Source
Single Supply
Power Dissipation (max)
65mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-LQFP
For Use With
EVAL-AD5382EB - BOARD EVAL FOR AD5382
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
AD5382
TIMING CHARACTERISTICS
SPI-, QSPI-, MICROWIRE-, OR DSP-COMPATIBLE SERIAL INTERFACE
DVDD = 2.7 V to 5.5 V; AVDD = 4.5 V to 5.5 V or 2.7 V to 3.6 V; AGND = DGND = 0 V; all specifications T
unless otherwise noted.
Table 6.
Parameter
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
1
2
3
4
5
1
2
3
4
5
6
7
7A
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Guaranteed by design and characterization, not production tested.
All input signals are specified with t
See Figure 2, Figure 3, Figure 4, and Figure 5.
Standalone mode only.
Daisy-chain mode only.
4
4
4
5
5
4
5
1, 2, 3
Limit at T
33
13
13
13
13
33
10
50
5
4.5
30
670
20
20
100
0
100
8
20
35
20
5
8
20
r
= t
f
= 5 ns (10% to 90% of V
MIN
, T
MAX
TO OUTPUT PIN
Figure 2. Load Circuit for SDO Timing Diagram
CC
(Serial Interface, Daisy-Chain Mode)
) and are timed from a voltage level of 1.2 V.
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns max
ns max
ns min
ns min
ns max
ns min
ns min
μs typ
ns min
μs max
ns max
ns min
ns min
ns min
Rev. B | Page 8 of 40
C
50pF
L
200μA
200μA
Description
SCLK cycle time
SCLK high time
SCLK low time
SYNC falling edge to SCLK falling edge setup time
24th SCLK falling edge to SYNC falling edge
Minimum SYNC low time
Minimum SYNC high time
Minimum SYNC high time in readback mode
Data setup time
Data hold time
24th SCLK falling edge to BUSY falling edge
BUSY pulse width low (single channel update)
24th SCLK falling edge to LDAC falling edge
LDAC pulse width low
BUSY rising edge to DAC output response time
BUSY rising edge to LDAC falling edge
LDAC falling edge to DAC output response time
DAC output settling time
CLR pulse width low
CLR pulse activation time
SCLK rising edge to SDO valid
SCLK falling edge to SYNC rising edge
SYNC rising edge to SCLK rising edge
SYNC rising edge to LDAC falling edge
I
I
OL
OH
V
V
OH
OL
(MAX)
(MIN) OR
MIN
to T
MAX
,