SAF7841HL/M295,557 NXP Semiconductors, SAF7841HL/M295,557 Datasheet - Page 10

• Manufacturer Part Number: SAF7841HL/M295,557
• Description: IC HD RADIO PROCESSOR 144HLQFP
• Manufacturer: NXP Semiconductors

Specifications of SAF7841HL/M295,557

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935288157557

NXP Semiconductors
TDA8954_1
Product data sheet
8.4.1.2 OverTemperature Protection (OTP)
Thermal foldback is active when:
T
The value of T
details. The gain will be reduced by at least 6 dB (to T
reaches T
TFB can be disabled by applying the appropriate voltage on pin MODE (see
which case the dissipation will not be limited by TFB. The junction temperature may then
rise as high as the OTP threshold, when the amplifier will be shut down (see
Section
audio holes.
The TFB warning signal is not disabled when the TFB is disabled via the MODE pin. This
allows a temperature control function in the application to monitor the junction
temperature and, if necessary, to reduce the level of the audio signal transmitted to the
amplifier.
If TFB fails to stabilize the temperature and the junction temperature continues to rise, the
amplifier will shut down as soon as the temperature reaches the thermal protection
activation threshold, T
after the temperature drops below T
The thermal behavior is illustrated in
Fig 7.
act(th_fold)
8.4.1.2). The amplifier will start up again once it has cooled down. This introduces
TFB and TFB warning
act(th_prot)
< T
T
act(warn)th_fold
j
T
act(th_fold)
< T
act(th_fold)
V
V
act(th_prot)
DIAG1
LOAD
(see
Rev. 01 — 24 December 2009
T
act(th_prot)
for the TDA8954 is approximately 145 °C; see
Figure
. The amplifier will resume switching approximately 100 ms
8).
act(th_prot)
Figure
8.
.
Thermal foldback activated
2 × 210 W class-D power amplifier
hg(th_fold)
) before the temperature
t
TDA8954
Table 9
© NXP B.V. 2009. All rights reserved.
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Table
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9), in
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