SAF7841HL/M295,557 NXP Semiconductors, SAF7841HL/M295,557 Datasheet - Page 42

• Manufacturer Part Number: SAF7841HL/M295,557
• Description: IC HD RADIO PROCESSOR 144HLQFP
• Manufacturer: NXP Semiconductors

Specifications of SAF7841HL/M295,557

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935288157557

NXP Semiconductors
17. Soldering of through-hole mount packages
TDA8954_1
Product data sheet
17.1 Introduction to soldering through-hole mount packages
17.2 Soldering by dipping or by solder wave
17.3 Manual soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
Fig 36. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 01 — 24 December 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
2 × 210 W class-D power amplifier
temperature
peak
stg(max)
TDA8954
© NXP B.V. 2009. All rights reserved.
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