XC3S100E-5TQG144C Xilinx Inc, XC3S100E-5TQG144C Datasheet - Page 168
![IC FPGA SPARTAN-3E 100K 144-TQFP](/photos/6/70/67094/144tqfp_sml.jpg)
XC3S100E-5TQG144C
Manufacturer Part Number
XC3S100E-5TQG144C
Description
IC FPGA SPARTAN-3E 100K 144-TQFP
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S100E-5TQG144C
Number Of Logic Elements/cells
2160
Number Of Labs/clbs
240
Total Ram Bits
73728
Number Of I /o
108
Number Of Gates
100000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
XC3S100E-5TQG144C
Manufacturer:
Xilinx Inc
Quantity:
10 000
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Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3E FPGA is reported using either
the
integrated in the Xilinx ISE® development software.
Table 130
ous Spartan-3E package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
Table 130: Spartan-3E Package Thermal Characteristics
168
Package
VQ100
CP132
TQ144
PQ208
FG320
FG400
FG484
FT256
XPower Estimator
provides the thermal characteristics for the vari-
XC3S1200E
XC3S1200E
XC3S1600E
XC3S1600E
XC3S1200E
XC3S1600E
XC3S100E
XC3S250E
XC3S500E
XC3S100E
XC3S250E
XC3S500E
XC3S100E
XC3S250E
XC3S250E
XC3S500E
XC3S250E
XC3S500E
XC3S500E
Device
or the
Junction-to-Case
XPower Analyzer
(θ
13.0
11.0
19.3
11.8
12.4
9.8
8.5
8.2
7.2
9.8
8.5
9.6
6.5
9.8
7.1
7.5
6.0
5.7
8.2
JC
)
JC
) indicates the
calculator
Junction-to-
Board (θ
www.xilinx.com
30.9
25.9
31.9
42.0
28.1
21.3
25.7
29.0
26.8
27.7
22.2
16.4
15.6
12.5
10.6
12.4
10.4
9.4
JB
)
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
Still Air
(0 LFM)
49.0
43.3
40.0
62.1
48.3
41.5
52.1
37.6
37.0
36.1
35.8
31.1
26.2
26.1
23.0
21.1
22.3
20.3
18.8
Junction-to-Ambient (θ
JA
at Different Air Flows
250 LFM
value in a system without a fan. The thermal
40.7
36.0
33.3
55.3
41.8
35.2
40.5
29.2
27.3
26.6
29.3
25.0
20.5
20.6
17.7
15.9
17.2
15.2
12.5
500 LFM
37.9
33.6
31.0
52.8
39.5
32.9
34.6
25.0
24.1
23.6
28.4
24.0
19.3
19.4
16.4
14.6
16.0
14.0
11.3
DS312-4 (v3.8) August 26, 2009
JA
750 LFM
)
Product Specification
37.0
32.7
30.2
51.2
38.0
31.5
32.5
23.4
22.4
21.8
28.1
23.6
18.9
18.6
15.7
13.8
15.3
13.3
10.8
JA
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
JB
Units
) value
) value
JA
R
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