XCV812E-8FG900C Xilinx Inc, XCV812E-8FG900C Datasheet - Page 105

• Manufacturer Part Number: XCV812E-8FG900C
• Description: IC FPGA 1.8V C-TEMP 900-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-8FG900C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 556
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 900-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 5:
DS025-4 (v1.6) July 17, 2002
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
R
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_L98P_YY
IO_VREF_2_L102P
IO_D3_L98N_YY
IO_VREF_L109N
IO_L99N_YY
IO_L99P_YY
IO_L100N_Y
IO_L111N_Y
IO_L100P_Y
IO_L111P_Y
Description
IO_L101N
IO_L102N
IO_L104N
IO_L106N
IO_L107N
IO_L108N
IO_L110N
IO_L101P
IO_L104P
IO_L106P
IO_L107P
IO_L108P
IO_L109P
IO_L110P
IO_L97P
IO_L97N
IO
IO
IO
IO
IO
IO
IO
Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
AG30
AB27
AF28
N25
N27
N30
N26
P28
P29
N24
P22
R26
P25
R29
R25
R24
V24
Y21
Y27
U29
R22
R23
U28
U30
U27
P21
T30
T24
T27
T28
T21
T25
T23
Pin
www.xilinx.com
1-800-255-7778
Table 5:
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_L113N_YY
IO_VREF_L124N_YY
IO_VREF_L117N_Y
IO_D5_L123N_YY
IO_D4_L113P_YY
IO_D6_L124P_YY
IO_VREF_L127N
IO_L112N_YY
IO_L116N_YY
IO_L130N_YY
IO_L112P_YY
IO_L116P_YY
IO_L123P_YY
IO_L130P_YY
IO_L121N_Y
IO_L129N_Y
IO_L117P_Y
IO_L121P_Y
IO_L129P_Y
Description
IO_L114N
IO_L115N
IO_L118N
IO_L120N
IO_L125N
IO_L126N
IO_L128N
IO_L114P
IO_L115P
IO_L118P
IO_L120P
IO_L125P
IO_L126P
IO_L127P
IO_L128P
Module 4 of 4
AA30
AA29
AB30
AA28
AA27
AB28
AC30
AA25
AA24
AB26
AD30
W30
W29
W27
W26
W25
W24
W22
W21
U25
V27
U24
V29
U22
U21
V26
Y29
Y30
V20
Y26
V21
Y25
Y23
Y24
Pin
29