XCV812E-8FG900C Xilinx Inc, XCV812E-8FG900C Datasheet - Page 108

• Manufacturer Part Number: XCV812E-8FG900C
• Description: IC FPGA 1.8V C-TEMP 900-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-8FG900C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 556
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 900-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
Table 5:
Module 4 of 4
32
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
6
6
6
6
6
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_5_L198N_YY
IO_VREF_5_L202N_YY
IO_VREF_5_L206N_YY
IO_L199P_YY
IO_L199N_YY
IO_L202P_YY
IO_L203P_YY
IO_L203N_YY
IO_L206P_YY
IO_L207P_YY
IO_L207N_YY
IO_L209N_Y
IO_L210N_Y
IO_L209P_Y
IO_L210P_Y
Description
IO_L200N
IO_L201N
IO_L204N
IO_L205N
IO_L200P
IO_L201P
IO_L204P
IO_L205P
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
AB11
AC11
AD10
AC10
AB10
W10
AH9
AK9
AG8
AK8
AG7
AK7
AH6
AD9
AG6
AC9
AG5
AK4
AA2
AA4
AD1
AF9
AF8
AF7
Y10
AJ7
AJ5
AJ4
Pin
U1
U6
T6
V7
V8
www.xilinx.com
1-800-255-7778
Table 5:
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_L222N_YY
IO_VREF_L218N_Y
IO_VREF_L226N
IO_L212N_YY
IO_L219N_YY
IO_L223N_YY
IO_L212P_YY
IO_L219P_YY
IO_L222P_YY
IO_L223P_YY
IO_L214N_Y
IO_L224N_Y
IO_L232N_Y
IO_L214P_Y
IO_L218P_Y
IO_L224P_Y
Description
IO_L215N
IO_L217N
IO_L220N
IO_L221N
IO_L225N
IO_L228N
IO_L230N
IO_L215P
IO_L217P
IO_L220P
IO_L221P
IO_L225P
IO_L226P
IO_L228P
IO_L230P
IO_VREF
IO
IO
DS025-4 (v1.6) July 17, 2002
AA10
AD6
AG2
AC6
AH1
AG1
AD4
AD5
AD2
AD3
AC4
AC1
AF3
AB9
AE4
AE3
AA9
AF2
AA8
AA7
AF1
AB6
AE1
AB4
AB3
AB1
V10
V11
AA3
Pin
W8
W9
W7
Y9
Y8
R