PIC12F508-I/P Microchip Technology, PIC12F508-I/P Datasheet - Page 13

• Manufacturer Part Number: PIC12F508-I/P
• Description: IC MCU FLASH 512X12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F508-I/P

• Program Memory Type: FLASH
• Program Memory Size: 768B (512 x 12)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 25 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164101, DM163014, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• Package: 8PDIP
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 4 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDM163029 - BOARD PICDEM FOR MECHATRONICSDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 3-2:
© 2009 Microchip Technology Inc.
GP0/ICSPDAT
GP1/ICSPCLK
GP2/T0CKI
GP3/MCLR/V
GP4/OSC2
GP5/OSC1/CLKIN
V
V
Legend: I = Input, O = Output, I/O = Input/Output, P = Power, — = Not used, TTL = TTL input,
DD
SS
Name
ST = Schmitt Trigger input, HV = High Voltage
PP
PIC12F508/509 PINOUT DESCRIPTION
Function
ICSPDAT
ICSPCLK
CLKIN
T0CKI
MCLR
OSC2
OSC1
GP0
GP1
GP2
GP3
GP4
GP5
V
V
V
DD
PP
SS
Input
XTAL
Type
TTL
TTL
TTL
TTL
TTL
TTL
ST
ST
ST
ST
HV
ST
—
—
—
Output
CMOS Bidirectional I/O pin. Can be software programmed for internal
CMOS In-Circuit Serial Programming™ data pin.
CMOS Bidirectional I/O pin. Can be software programmed for internal
CMOS In-Circuit Serial Programming clock pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
XTAL
Type
—
—
—
—
—
—
P
P
weak pull-up and wake-up from Sleep on pin change.
weak pull-up and wake-up from Sleep on pin change.
Clock input to TMR0.
Input pin. Can be software programmed for internal weak
pull-up and wake-up from Sleep on pin change.
Master Clear (Reset). When configured as MCLR, this pin is
an active-low Reset to the device. Voltage on MCLR/V
not exceed V
will enter Programming mode. Weak pull-up always on if
configured as MCLR.
Programming voltage input.
Oscillator crystal output. Connections to crystal or resonator in
Crystal Oscillator mode (XT and LP modes only, GPIO in other
modes).
Oscillator crystal input.
External clock source input.
Positive supply for logic and I/O pins.
Ground reference for logic and I/O pins.
PIC12F508/509/16F505
DD
during normal device operation or the device
Description
DS41236E-page 13
PP
must