PIC12F508-I/P Microchip Technology, PIC12F508-I/P Datasheet - Page 16

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PIC12F508-I/P

Manufacturer Part Number
PIC12F508-I/P
Description
IC MCU FLASH 512X12 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr

Specifications of PIC12F508-I/P

Program Memory Type
FLASH
Program Memory Size
768B (512 x 12)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
25 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
6
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164101, DM163014, DV164120, DM163029
Minimum Operating Temperature
- 40 C
Package
8PDIP
Device Core
PIC
Family Name
PIC12
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDM163029 - BOARD PICDEM FOR MECHATRONICSDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC12F508-I/P
Manufacturer:
Grayhill
Quantity:
101
Part Number:
PIC12F508-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC12F508-I/P
0
Company:
Part Number:
PIC12F508-I/P
Quantity:
9 000
PIC12F508/509/16F505
3.1
The clock input (OSC1/CLKIN pin) is internally divided
by four to generate four non-overlapping quadrature
clocks, namely Q1, Q2, Q3 and Q4. Internally, the PC
is incremented every Q1 and the instruction is fetched
from program memory and latched into the instruction
register in Q4. It is decoded and executed during the
following Q1 through Q4. The clocks and instruction
execution flow is shown in Figure 3-3 and Example 3-1.
FIGURE 3-3:
EXAMPLE 3-1:
DS41236E-page 16
1. MOVLW 03H
2. MOVWF PORTB
3. CALL
4. BSF
All instructions are single cycle, except for any program branches. These take two cycles, since the fetch instruction
is “flushed” from the pipeline, while the new instruction is being fetched and then executed.
Clocking Scheme/Instruction
Cycle
SUB_1
PORTB, BIT1
OSC1
PC
Q1
Q2
Q3
Q4
CLOCK/INSTRUCTION CYCLE
INSTRUCTION PIPELINE FLOW
Q1
Execute INST (PC – 1)
Fetch INST (PC)
Q2
Fetch 1
PC
Q3
Execute 1
Q4
Fetch 2
Q1
Execute INST (PC)
Fetch INST (PC + 1)
Execute 2
Q2
Fetch 3
PC + 1
3.2
An instruction cycle consists of four Q cycles (Q1, Q2,
Q3 and Q4). The instruction fetch and execute are
pipelined such that fetch takes one instruction cycle,
while decode and execute take another instruction
cycle. However, due to the pipelining, each instruction
effectively executes in one cycle. If an instruction
causes the PC to change (e.g., GOTO), then two cycles
are required to complete the instruction (Example 3-1).
A fetch cycle begins with the PC incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the Instruction Register (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3 and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
Q3
Execute 3
Q4
Fetch 4
Instruction Flow/Pipelining
Q1
Fetch SUB_1 Execute SUB_1
Execute INST (PC + 1)
Fetch INST (PC + 2)
Q2
Flush
© 2009 Microchip Technology Inc.
PC + 2
Q3
Q4
Internal
phase
clock

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