PIC12F508-I/P Microchip Technology, PIC12F508-I/P Datasheet - Page 15

• Manufacturer Part Number: PIC12F508-I/P
• Description: IC MCU FLASH 512X12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F508-I/P

• Program Memory Type: FLASH
• Program Memory Size: 768B (512 x 12)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 25 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164101, DM163014, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• Package: 8PDIP
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 4 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDM163029 - BOARD PICDEM FOR MECHATRONICSDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 3-3:
© 2009 Microchip Technology Inc.
RB0/ICSPDAT
RB1/ICSPCLK
RB2
RB3/MCLR/V
RB4/OSC2/CLKOUT
RB5/OSC1/CLKIN
RC0
RC1
RC2
RC3
RC4
RC5/T0CKI
V
V
Legend: I = Input, O = Output, I/O = Input/Output, P = Power, — = Not used, TTL = TTL input,
DD
SS
Name
ST = Schmitt Trigger input, HV = High Voltage
PP
PIC16F505 PINOUT DESCRIPTION
Function
ICSPDAT
ICSPCLK
CLKOUT
CLKIN
MCLR
OSC2
OSC1
T0CKI
RB0
RB1
RB2
RB3
RB4
RB5
RC0
RC1
RC2
RC3
RC4
RC5
V
V
V
DD
PP
SS
Input
XTAL
Type
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
ST
ST
ST
HV
ST
ST
—
—
—
—
Output
CMOS Bidirectional I/O pin. Can be software programmed for internal
CMOS In-Circuit Serial Programming™ data pin.
CMOS Bidirectional I/O pin. Can be software programmed for internal
CMOS In-Circuit Serial Programming clock pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin. Can be software programmed for internal
CMOS In EXTRC and INTRC modes, the pin output can be
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
CMOS Bidirectional I/O pin.
XTAL
Type
—
—
—
—
—
—
P
P
weak pull-up and wake-up from Sleep on pin change.
weak pull-up and wake-up from Sleep on pin change.
Input port. Can be software programmed for internal weak
pull-up and wake-up from Sleep on pin change.
Master Clear (Reset). When configured as MCLR, this pin is
an active-low Reset to the device. Voltage on MCLR/V
not exceed V
will enter Programming mode. Weak pull-up always on if
configured as MCLR.
Programming voltage input.
weak pull-up and wake-up from Sleep on pin change.
Oscillator crystal output. Connections to crystal or resonator in
Crystal Oscillator mode (XT, HS and LP modes only).
configured for CLKOUT, which has 1/4 the frequency of OSC1
and denotes the instruction cycle rate.
Crystal input.
External clock source input.
Clock input to TMR0.
Positive supply for logic and I/O pins.
Ground reference for logic and I/O pins.
PIC12F508/509/16F505
DD
during normal device operation or the device
Description
DS41236E-page 15
PP
must