MPC8541EVTAPF Freescale Semiconductor, MPC8541EVTAPF Datasheet - Page 67

• Manufacturer Part Number: MPC8541EVTAPF
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIIr

Specifications of MPC8541EVTAPF

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 833MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 833MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 783
• Supply Voltage Range: 1.14V To 1.26V
• Rohs Compliant: Yes
• Family Name: MPC85XX
• Device Core: PowerQUICC III
• Device Core Size: 32b
• Frequency (max): 833MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 783
• Package Type: FCBGA
• For Use With: MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

16 Thermal
This section describes the thermal specifications of the MPC8541E.
16.1
Table 49
Junction-to-ambient Natural Convection on four layer board (2s2p)
Junction-to-ambient (@200 ft/min or 1.0 m/s) on four layer board (2s2p)
Junction-to-ambient (@400 ft/min or 2.0 m/s) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51–6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
16.2
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
Freescale Semiconductor
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance
the top surface of the board near the package.
1012.1). Cold plate temperature is used for case temperature; measured value includes the thermal resistance of the
interface layer.
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
provides the package thermal characteristics for the MPC8541E.
Thermal Characteristics
Thermal Management Information
Characteristic
Table 49. Package Thermal Characteristics
Figure
42. The heat sink should be attached to the printed-circuit
Symbol
R
R
R
R
R
θJMA
θJMA
θJMA
θJB
θJC
Value
0.96
17
14
13
10
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
Thermal
1, 2
1, 2
1, 2
3
4
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