MPC8360VVAGDGA Freescale Semiconductor, MPC8360VVAGDGA Datasheet - Page 84
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MPC8360VVAGDGA
Manufacturer Part Number
MPC8360VVAGDGA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8360CZUAJDG.pdf
(108 pages)
Specifications of MPC8360VVAGDGA
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8360E-RDK
Maximum Clock Frequency
400 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8360VVAGDGA
Manufacturer:
AVX
Quantity:
3 000
Company:
Part Number:
MPC8360VVAGDGA
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MPC8360VVAGDGA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package and Pin Listings
84
NC
Notes:
1. This pin is an open drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OV
2. This pin is an open drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OV
3. This output is actively driven during reset rather than being three-stated during reset.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull up if the chip is in PCI host mode. Follow PCI specifications recommendation.
6. These are On Die Termination pins, used to control DDR2 memories internal termination resistance.
7. This pin must always be tied to GND.
8. This pin must always be left not connected.
9. Refers to MPC8360E PowerQUICC II Pro Integrated Communications Processor Family Reference Manual section on
10.This pin must always be tied to GV
11. It is recommended that MDIC0 be tied to GND using an 18.2 Ω resistor and MDIC1 be tied to DDR power using an 18.2 Ω
“RGMII Pins,” for information about the two UCC2 Ethernet interface options.
resistor for DDR2.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Signal
Table 67. MPC8358E TBGA Pinout Listing (continued)
DD
AM16, AM17, AM20, AN13, AN16, AN17, AP10,
AP11, AP13, AP15, AP18, AR11, AR13, AR14,
AR15, AR16, AR17, AR20, AT11, AT12, AT13,
AT14, AT16, AT17, AT18, AU10, AU11, AU12,
AU13, AU15, AU19
.
Package Pin Number
No Connect
Pin Type
—
DD.
Freescale Semiconductor
DD
.
Supply
Power
—
Notes
—