MPC8555ECPXAJD Freescale Semiconductor, MPC8555ECPXAJD Datasheet - Page 57

• Manufacturer Part Number: MPC8555ECPXAJD
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8555ECPXAJD

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• For Use With: MPC8555CDS - BOARD EVALUATION CDS FOR 8555CWH-PPC-8555N-VX - BOARD EVAL QUICCSTART MPC8555CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540CWH-PPC-8555N-VE - EVALUATION SYSTEM QUICC MPC8555E
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

14.2
Figure 42
package.
Notes:
Freescale Semiconductor
1.
2.
3.
4.
5.
6.
7.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
The socket lid must always be oriented to A1.
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Mechanical Dimensions of the FC-PBGA
Figure 42. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA
the mechanical dimensions and bottom surface nomenclature of the MPC8555E 783 FC-PBGA
Package and Pin Listings
57