MPC8541EVTAQF Freescale Semiconductor, MPC8541EVTAQF Datasheet - Page 74

• Manufacturer Part Number: MPC8541EVTAQF
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8541EVTAQF

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 1.0GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Development Tools By Supplier: RDK-IDM-SBC
• Maximum Clock Frequency: 1000 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• For Use With: MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Thermal
The spring mounting should be designed to apply the force only directly above the die. By localizing the
force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to
the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the
opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the
package.
Figure 47
and provide exploded views of the plastic fence, heat sink, and spring clip.
Figure 47. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
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Freescale Semiconductor