PCX745BVZFU350LE Atmel, PCX745BVZFU350LE Datasheet - Page 47

• Manufacturer Part Number: PCX745BVZFU350LE
• Description: IC MPU 32BIT 350MHZ 255PBGA
• Manufacturer: Atmel

Specifications of PCX745BVZFU350LE

• Processor Type: PowerPC 32-Bit RISC
• Speed: 350MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 255-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

11.1.2
Figure 11-2. Mechanical Dimensions and Bottom Surface Nomenclature of the PC745 PBGA
11.2
2138G–HIREL–05/06
e
Package Parameter for the PC755
2X
A1 CORNER
Mechanical Dimensions of the PC745 PBGA Package
0.2
1 2 3 4 5 6 7 8 9 10 111213141516
E
B
E1
255X
Figure 11-2
PC745, 255 PBGA package.
The package parameters are as provided in the following list. The package type is 25 x 25 mm,
360-lead plastic ball grid array (PBGA).
Table 11-2.
Parameter
Package Outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
b
0.3
0.15
C
C
D1
A
D
B
provides the mechanical dimensions and bottom surface nomenclature of the
Package Parameters
M
R
P
N
K
H
G
E
D
C
B
A
T
L
J
F
0.2
A
0.2 C
HiTCE-CBGA
25 mm × 25 mm
360 (19 x 19 ball array – 1)
1.27 mm (50 mil)
2,65 mm
3,2 mm
0,89 mm (35 mil)
A
A1
A2
C
Notes:
1. Dimensioning and tolerancing per
2. Dimensions in millimeters
3. Top side A1 corner index is a metalized
4. Capacitor Pads may be unpopulated
ASME Y14.5M, 1994
feature with various shapes. Bottom side
A1 corner is designated with a ball missing
from the array
Dim
A1
A2
D1
E1
A
D
b
E
e
PBGA
25 mm × 25 mm
360 (19 x 19 ball array – 1
1.27 mm (50 mil)
2.22 mm
2.77 mm
0.75 mm (29.5 mil)
2.25
0.50
1.00
0.60
Min
Millimeters
21.00 BSC
21.00 BSC
1.27 BSC
6.75
7.87
PC755/745
Max
2.80
0.70
1.20
0.90
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