Z0840004PSC Zilog, Z0840004PSC Datasheet - Page 96

• Manufacturer Part Number: Z0840004PSC
• Description: IC 4MHZ Z80 NMOS CPU 40-DIP
• Manufacturer: Zilog

Specifications of Z0840004PSC

• Processor Type: Z80
• Features: NMOS
• Speed: 4MHz
• Voltage: 5V
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.620", 15.75mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ZiLOG
ZAC03-0004
TERM
Poly Re-ox:
Positive photoresist:
Prebake:
Probe:
Process Templating:
Projection Aligner:
Pyrox:
QA:
QE:
QR-XXXX:
RBS:
RE:
RGA:
QFP:
QIP:
Q&R:
RH:
RIE:
RMA:
ROM:
Refractive Index:
Resist:
DEFINITION
Oxidation of the poly after it has been defined. The re-ox provides
the interpoly di-electric in a double (two layer) poly process.
A photosensitive organic polymer material in which exposed areas
are developed away.
First step of dry masking, in which the wafers are dried in an oven
prior to resist application.
The first electrical test of processed wafers.
The profile displayed by the process evaluation parameters, which
are automatically recorded from the test patterns on wafers as they
proceed through the production line.
A machine which projects the photomask onto the resist-coated
wafer. The mask is the same size as the wafer and imaged 1:1 on
the wafer.
A type of phosphosilicate glass containing approximately 4.5 wt
Phosphorous.
Quality Assurance.
Quality Engineer.
Product or Process Qualification Report (XXXX = report number).
Rutherford Back Scattering. A method for non-destructive depth
profile analysis of thin films by back scattering of high-energy
helium ions.
Reliability Engineer.
Residual Gas Analysis.
Quad Flat Package.
Quality Improvement Process.
Quality and Reliability.
Relative Humidity.
Reactive Ion Etch.
Return Material Authorization.
Read Only Memory.
A basic physical property which determines the extent of light
bending (refraction) upon entering the surface. Used in thin film
process control as an indirect measure of chemistry.
See Photoresist.
2002 Quality and Reliability Report
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