N80960SB16 Intel, N80960SB16 Datasheet - Page 2

• Manufacturer Part Number: N80960SB16
• Description: IC MPU I960SB 16MHZ 84-PLCC
• Manufacturer: Intel

Specifications of N80960SB16

• Rohs Status: RoHS non-compliant
• Processor Type: i960
• Features: SB suffix, 32-Bit, 512 Byte Cache
• Speed: 16MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 84-PLCC
• Other names: 803883

CONTENTS
1.0 THE i960
2.0 ELECTRICAL SPECIFICATIONS............................................................................................................. 11
3.0 MECHANICAL DATA ............................................................................................................................... 20
4.0 WAVEFORMS ........................................................................................................................................... 27
5.0 REVISION HISTORY ................................................................................................................................ 33
ii
1.1 Key Performance Features .................................................................................................................2
2.1 Power and Grounding ....................................................................................................................... 11
2.2 Power Decoupling Recommendations .............................................................................................. 11
2.3 Connection Recommendations ......................................................................................................... 11
2.4 Characteristic Curves ....................................................................................................................... 11
2.5 Test Load Circuit ............................................................................................................................... 13
2.6 ABSOLUTE MAXIMUM RATINGS* .................................................................................................. 14
2.7 DC Characteristics ............................................................................................................................ 14
2.8 AC Specifications .............................................................................................................................. 15
3.1 Packaging ......................................................................................................................................... 20
3.2 Pin Assignment ................................................................................................................................. 20
3.3 Pinout ................................................................................................................................................ 22
3.4 Package Thermal Specifications ...................................................................................................... 26
1.1.1 Memory Space And Addressing Modes ................................................................................... 4
1.1.2 Data Types ...............................................................................................................................4
1.1.3 Large Register Set ...................................................................................................................4
1.1.4 Multiple Register Sets ..............................................................................................................5
1.1.5 Instruction Cache .....................................................................................................................5
1.1.6 Register Scoreboarding ........................................................................................................... 5
1.1.7 Floating-Point Arithmetic .......................................................................................................... 6
1.1.8 High Bandwidth Bus ................................................................................................................6
1.1.9 Interrupt Handling ....................................................................................................................7
1.1.10 Debug Features .....................................................................................................................7
1.1.11 Fault Detection .......................................................................................................................7
1.1.12 Built-in Testability ...................................................................................................................7
1.1.13 CHMOS .................................................................................................................................. 7
®
PROCESSOR ...........................................................................................................................1
EMBEDDED 32-BIT MICROPROCESSOR
WITH 16-BIT BURST DATA BUS
80960SB
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