MPC852TVR50 Freescale Semiconductor, MPC852TVR50 Datasheet - Page 77

IC MPU POWERQUICC 50MHZ 256-PBGA

MPC852TVR50

Manufacturer Part Number
MPC852TVR50
Description
IC MPU POWERQUICC 50MHZ 256-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC852TVR50

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
1.8V
Mounting Type
Surface Mount
Package / Case
256-PBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

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Mechanical Data and Ordering Information
NOTES:
1. All dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M—1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Note:
Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC852TVRXXX.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC852TZTXXX.
Figure 64. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
MPC852T Hardware Specifications, Rev. 3.1
Freescale Semiconductor
77

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