ENC28J60-I/SP Microchip Technology, ENC28J60-I/SP Datasheet - Page 86

IC ETHERNET CTRLR W/SPI 28DIP

ENC28J60-I/SP

Manufacturer Part Number
ENC28J60-I/SP
Description
IC ETHERNET CTRLR W/SPI 28DIP
Manufacturer
Microchip Technology
Datasheets

Specifications of ENC28J60-I/SP

Package / Case
28-DIP (0.300", 7.62mm)
Controller Type
Ethernet Controller, MAC/10Base-T
Interface
SPI
Voltage - Supply
3.1 V ~ 3.6 V
Current - Supply
160mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Input Voltage Range (max)
5.5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Operating Supply Voltage
3.1 V to 3.6 V
Supply Current (max)
180 mA
Product
Ethernet Controllers
Standard Supported
IEEE 802.3
Data Rate
10 Mbps
Ethernet Connection Type
10Base-T
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163024 - BOARD DEMO PICDEM.NET 2AC164123 - BOARD DAUGHTER ETH PICTAIL PLUSAC164121 - BOARD DAUGHTER PICTAIL ETHERNET
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ENC28J60-I/SP
Manufacturer:
MICROCHIP
Quantity:
6 500
Part Number:
ENC28J60-I/SP
Manufacturer:
MICROCHIP
Quantity:
2 000
Part Number:
ENC28J60-I/SP
Manufacturer:
MICROCHIP
Quantity:
5 000
Company:
Part Number:
ENC28J60-I/SP
Quantity:
1 150
ENC28J60
17.2
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
DS39662B-page 84
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
Package Details
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
E1
B1
eB
A1
D
A
E
B
n
p
L
c
MIN
1.345
.125
.015
.275
.125
Preliminary
.140
.300
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
© 2006 Microchip Technology Inc.
MILLIMETERS
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
MAX
35.18
10.92
1.65
4.06
3.43
8.26
7.49
3.43
0.38
0.56
15
15

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