TDA8026ET/C2,557 NXP Semiconductors, TDA8026ET/C2,557 Datasheet - Page 53
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
TDA8026ET/C2,557
Manufacturer Part Number
TDA8026ET/C2,557
Description
IC SMART CARD SLOT 64TFBGA
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8026ETC2518.pdf
(59 pages)
Specifications of TDA8026ET/C2,557
Controller Type
Smart Card Interface
Interface
I²C
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
210mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8026ET/C2,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
15. Abbreviations
16. Revision history
Table 52.
[1]
TDA8026_1
Product data sheet
Document ID
TDA8026_1
Versions 1.0 to 1.2 have all been superseded by this version which includes changes to symbols, pin names and drawings.
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 51.
Acronym
ATR
CDM
ESD
ESR
HBM
LSB
MM
MSB
PCB
POR
POS
SAM
Fig 16. Temperature profiles for large and small components
Release date
20100309
temperature
MSL: Moisture Sensitivity Level
Abbreviations and acronyms
All information provided in this document is subject to legal disclaimers.
Description
Answer To Request
Charged Device Model
ElectroStatic Discharge
Equivalent Series Resistance
Human Body Model
Least Significant Bit
Machine Model
Most Significant Bit
Printed-Circuit Board
Power-On Reset
Point Of Sales
Security Access Module
Data sheet status
Product data sheet
Rev. 1 — 9 March 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
Multiple smart card slot interface IC
temperature
Supersedes
1.2
peak
TDA8026
© NXP B.V. 2010. All rights reserved.
001aac844
time
53 of 59