PIC24FJ32GA002-I/SP Microchip Technology Inc., PIC24FJ32GA002-I/SP Datasheet - Page 242

• Manufacturer Part Number: PIC24FJ32GA002-I/SP
• Description: MCU, 16-Bit, 28-Pin, 32KB Flash, 8KB RAM, 21 I/O, Nanowatt
• Manufacturer: Microchip Technology Inc.

Specifications of PIC24FJ32GA002-I/SP

• A/d Inputs: 10 Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 16 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 21
• Interface: I2C/SPI/UART
• Memory Capacity: 32 Kbytes
• Memory Type: Flash
• Number Of Bits: 16
• Number Of Inputs: 21
• Number Of Pins: 28
• Package Type: 28-pin SPDIP
• Programmable Memory: 32K Bytes
• Ram Size: 8K Bytes
• Speed: 32 MHz
• Timers: 5-16-bit
• Voltage, Range: 2-3.6 V
• Voltage, Rating: 2-3.6 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC24FJ64GA004 FAMILY
DS39881B-page 240
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
Preliminary
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
A2
E
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
MIN
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
© 2007 Microchip Technology Inc.
10.50
MAX
2.00
1.85
8.20
5.60
0.95
0.25
0.38
8°
–
φ
L