PIC32MX675F512L-80V/BG Microchip Technology, PIC32MX675F512L-80V/BG Datasheet - Page 204
![512 KB Flash, 64 KB RAM, USB-OTG, Ethernet, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x](/photos/40/62/406286/landingpagemicrochippic32_sml.jpg)
PIC32MX675F512L-80V/BG
Manufacturer Part Number
PIC32MX675F512L-80V/BG
Description
512 KB Flash, 64 KB RAM, USB-OTG, Ethernet, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheet
1.PIC32MX575F256H-80VPT.pdf
(256 pages)
Specifications of PIC32MX675F512L-80V/BG
Processor Series
PIC32MX6xx
Core
MIPS
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
512 KB
Data Ram Size
64 KB
Interface Type
USB, I2C, UART, RS-232, RS-485, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
5
Number Of Timers
5
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
XBGA-100
Operating Temperature Range
- 40 C to + 85 C
Supply Current (max)
10 mA
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
Ethernet, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
-
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX675F512L-80V/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
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PIC32MX5XX/6XX/7XX
FIGURE 31-11:
TABLE 31-29: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
DS61156G-page 204
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP36
SP40
SP41
Note 1:
Param.
No.
Note: Refer to
SCK
(CKP = 0)
(CKP = 1)
SDO
SDI
SCK
2:
3:
4:
X
X
X
X
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SC
SC
SC
SC
SC
SC
SC
SC
DO
DO
DO
DO
DI
DI
Symbol
These parameters are characterized, but not tested in manufacturing.
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The minimum clock period for SCKx is 40 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
V2
V2
L
H
F
R
H2
L2
H2
L2
F
R
V2
V2
SC
SC
DO
DI
DO
DI
SC
SC
Figure 31-1
L
H,
L
L,
V
V,
,
L
SP40
SP36
SCKx Output Low Time
SCKx Output High Time
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data Input to
SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS
MSb In
for load conditions.
MSb
Characteristics
SP41
SP11
SP30,SP31
SP35
SP10
(4)
(3)
(1)
(4)
(3)
Bit 14 - - - - - -1
Bit 14 - - - -1
(4)
(4)
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
T
T
Min.
SCK
SCK
15
15
20
15
20
—
—
—
—
—
—
/2
/2
SP21
SP20
Typ.
LSb In
—
—
—
—
—
—
—
—
—
—
—
—
—
LSb
(2)
SP20
SP21
Max.
15
20
—
—
—
—
—
—
—
—
—
—
—
© 2009-2011 Microchip Technology Inc.
-40°C ≤ T
-40°C ≤ T
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
See parameter DO32
See parameter DO31
See parameter DO32
See parameter DO31
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
> 2.7V
< 2.7V
> 2.7V
< 2.7V
> 2.7V
< 2.7V
Conditions
—
—
—
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