NTTFS4928NTAG ON Semiconductor, NTTFS4928NTAG Datasheet

MOSFET N-CH 30V 41A 8WDFN

NTTFS4928NTAG

Manufacturer Part Number
NTTFS4928NTAG
Description
MOSFET N-CH 30V 41A 8WDFN
Manufacturer
ON Semiconductor
Series
-r
Datasheet

Specifications of NTTFS4928NTAG

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
9 mOhm @ 20A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
7.3A
Vgs(th) (max) @ Id
2.2V @ 250µA
Gate Charge (qg) @ Vgs
8nC @ 4.5V
Input Capacitance (ciss) @ Vds
913pF @ 15V
Power - Max
810mW
Mounting Type
*
Package / Case
*
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
13.5 mOhms
Forward Transconductance Gfs (max / Min)
40 S
Drain-source Breakdown Voltage
30 V
Continuous Drain Current
11.8 A
Power Dissipation
2.12 W
Mounting Style
SMD/SMT
Fall Time
4.4 ns
Gate Charge Qg
8 nC
Rise Time
25.5 ns
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
NTTFS4928NTAG
Manufacturer:
ON Semiconductor
Quantity:
800
Part Number:
NTTFS4928NTAG
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
NTTFS4928NTAG
Quantity:
2 500
Company:
Part Number:
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Quantity:
3 000
Company:
Part Number:
NTTFS4928NTAG
Quantity:
2 100
NTTFS4928N
Power MOSFET
30 V, 37 A, Single N−Channel, m8FL
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 0
MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R
Power Dissipation R
(Note 1)
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Continuous Drain
Current R
Power Dissipation
R
Continuous Drain
Current R
Power Dissipation
R
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse Drain−to−Source Avalanche Energy
(T
I
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
L
Compliant
Low R
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
DC−DC Converters
Power Load Switch
Notebook Battery Management
Motor Control
qJA
qJA
qJC
J
= 20 A
= 25°C, V
≤ 10 s (Note 1)
(Note 2)
(Note 1)
pk
DS(on)
qJA
qJA
qJA
qJC
, L = 0.1 mH, R
DD
(Note 1)
≤ 10 s
(Note 2)
(Note 1)
to Minimize Conduction Losses
= 50 V, V
Parameter
qJA
(T
G
GS
J
Steady
T
= 25 W)
State
= 25°C unless otherwise stated)
A
= 10 V,
= 25°C, t
T
T
T
T
T
T
T
T
T
T
T
T
p
A
A
A
A
A
A
A
A
A
C
C
C
= 10 ms
= 25°C
= 85°C
= 25°C
= 25°C
= 85°C
= 25°C
= 25°C
= 85°C
= 25°C
= 25°C
= 85°C
= 25°C
Symbol
V
dV/dt
V
E
T
I
T
P
P
P
P
DSS
T
I
I
I
I
DM
I
stg
GS
AS
D
D
D
D
S
J
D
D
D
D
L
,
−55 to
Value
+150
11.8
2.12
15.9
11.5
3.86
0.81
20.8
±20
160
260
8.5
7.3
5.2
6.0
30
37
27
20
20
1
V/ns
Unit
mJ
°C
°C
W
W
W
W
V
V
A
A
A
A
A
A
†For information on tape and reel specifications,
NTTFS4928NTAG
NTTFS4928NTWG
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
CASE 511AB
(BR)DSS
30 V
(Note: Microdot may be in either location)
Device
WDFN8
(m8FL)
ORDERING INFORMATION
4928
A
Y
WW
G
G (4)
1
http://onsemi.com
N−Channel MOSFET
13.5 mW @ 4.5 V
9.0 mW @ 10 V
R
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
D (5−8)
DS(on)
(Pb−Free)
(Pb−Free)
Package
WDFN8
WDFN8
MARKING DIAGRAM
Publication Order Number:
G
S
S
S
MAX
1
S (1,2,3)
AYWWG
4928
1500 / Tape &
5000 / Tape &
NTTFS4928N/D
G
Shipping
Reel
Reel
I
D
37 A
MAX
D
D
D
D

Related parts for NTTFS4928NTAG

NTTFS4928NTAG Summary of contents

Page 1

... (Note: Microdot may be in either location 20 160 A DM Device T , −55 to °C J NTTFS4928NTAG T +150 stg NTTFS4928NTWG dV/dt 6.0 V/ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification T 260 °C Brochure, BRD8011/D. ...

Page 2

THERMAL RESISTANCE MAXIMUM RATINGS Parameter Junction−to−Case (Drain) Junction−to−Ambient – Steady State (Note 3) Junction−to−Ambient – Steady State (Note 4) Junction−to−Ambient – (t ≤ (Note 3) 3. Surface−mounted on FR4 board using 1 sq−in pad Cu. 4. ...

Page 3

ELECTRICAL CHARACTERISTICS (T Parameter SWITCHING CHARACTERISTICS (Note 6) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage Reverse Recovery Time Charge Time Discharge Time Reverse Recovery Charge PACKAGE PARASITIC VALUES Source Inductance Drain ...

Page 4

25° DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.015 0.014 0.013 0.012 0.011 0.010 0.009 0.008 0.007 ...

Page 5

C 1000 iss 800 600 C oss 400 200 C rss DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 100 I ...

Page 6

D = 0.5 0.2 10 0.1 0.05 0.02 1 0.01 0.1 SINGLE PULSE 0.01 0.000001 0.00001 0.0001 TYPICAL CHARACTERISTICS 0.001 0.01 0.1 t, TIME (s) Figure 13. Thermal Response http://onsemi.com 100 1000 ...

Page 7

... M 0.57 0.75 0.47 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...

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