OM13001,598 NXP Semiconductors, OM13001,598 Datasheet - Page 110
OM13001,598
Manufacturer Part Number
OM13001,598
Description
EA LPC177X/8X EVAL BOARD
Manufacturer
NXP Semiconductors
Series
-r
Type
MCUr
Specifications of OM13001,598
Contents
Board, Cable, Headphones, Registration Card
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
LPC1788
Other names
568-6707
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NXP Semiconductors
LPC178X_7X
Objective data sheet
Fig 47. Reflow soldering of the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 May 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC178x/7x
© NXP B.V. 2011. All rights reserved.
sot570-2_fr
SOT570-2
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