OM13001,598 NXP Semiconductors, OM13001,598 Datasheet - Page 70

• Manufacturer Part Number: OM13001,598
• Description: EA LPC177X/8X EVAL BOARD
• Manufacturer: NXP Semiconductors
• Series: -r
• Type: MCUr

Specifications of OM13001,598

• Contents: Board, Cable, Headphones, Registration Card
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: LPC1788
• Other names: 568-6707

NXP Semiconductors
9. Thermal characteristics
Table 10.
V
LPC178X_7X
Objective data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
•
•
•

=
T
R
P
40
amb
D
th(j-a)
T
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
= the package junction-to-ambient thermal resistance (C/W)
+

P
D
All information provided in this document is subject to legal disclaimers.

Conditions

C unless otherwise specified;
R
th j a

–
Rev. 2 — 27 May 2011


J
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
LPC178x/7x
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
70 of 117
C
(1)