LFXP10C-4F388C Lattice, LFXP10C-4F388C Datasheet - Page 124

• Manufacturer Part Number: LFXP10C-4F388C
• Description: IC FPGA 9.7KLUTS 244I/O 388-BGA
• Manufacturer: Lattice

Specifications of LFXP10C-4F388C

• Lead Free Status / Rohs Status: Contains lead / RoHS non-compliant

Pinout Information
Lattice Semiconductor
LatticeXP Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from 
www.latticesemi.com/software
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