LFXP10C-4F388C Lattice, LFXP10C-4F388C Datasheet - Page 388
LFXP10C-4F388C
Manufacturer Part Number
LFXP10C-4F388C
Description
IC FPGA 9.7KLUTS 244I/O 388-BGA
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP10C-4F388C
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP10C-4F388C
Manufacturer:
LATTICE
Quantity:
80
Company:
Part Number:
LFXP10C-4F388C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Company:
Part Number:
LFXP10C-4F388C-3I
Manufacturer:
LATTICE
Quantity:
3
- Current page: 388 of 397
- Download datasheet (10Mb)
PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
Figure 14-11. CAM Artwork Screen Shots, Example #2, 256-ball caBGA
Layer 1 Primary
Layer 2 GND
Layer 3 Power
Layer 4 Secondary
PCB Fabrication Cost and Design Rule Considerations
PCB fabrication cost is a key consideration for many electronics products. By reviewing the IC device package ball
density and pitch, I/O signal requirements of your application, and the manufacturing constraints of your PCB fabri-
cation facility you can better weigh the trade-offs between design decisions.
Choosing the best package for your application involves answering a few questions:
• What is the driving factor in the application? The smallest possible form factor or a low PCB cost?
• How many I/O signals does the application require?
• What PCB layer stack up will provide the best I/O density within budget?
• What layout design rules does the printed-circuit board (PCB) vendor support?
• How many PCB layers does the budget allow?
As the ball pitch becomes smaller with each new BGA generation, new PCB fabrication techniques and signal via
type have been developed to handle the complexities. Micro vias, laser vias, filled, buried and blind vias, even bur-
ied and plated over vias. Complex boards use a combination of most of these.
14-13
Related parts for LFXP10C-4F388C
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
FPGA - Field Programmable Gate Array 9.7K LUTs 188 I/O 1.8/2.5/3.3V -4 Spd
Manufacturer:
Lattice
Datasheet:
Part Number:
Description:
FPGA - Field Programmable Gate Array 9.7K LUTs 244 IO 1.8 /2.5/3.3V -4 Spd I
Manufacturer:
Lattice
Part Number:
Description:
FPGA - Field Programmable Gate Array 9.7K LUTs 188 IO 1.8 /2.5/3.3V -3 Spd I
Manufacturer:
Lattice
Datasheet:
Part Number:
Description:
FPGA - Field Programmable Gate Array 9.7K LUTS 188 I/O
Manufacturer:
Lattice
Datasheet:
Part Number:
Description:
FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
Manufacturer:
LATTICE SEMICONDUCTOR
Datasheet:
Part Number:
Description:
FPGA LatticeXP Family 10000 Cells 360MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
Manufacturer:
LATTICE SEMICONDUCTOR
Datasheet:
Part Number:
Description:
FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 388-Pin FBGA Tray
Manufacturer:
LATTICE SEMICONDUCTOR
Datasheet:
Part Number:
Description:
FPGA LatticeXP Family 10000 Cells 400MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
Manufacturer:
LATTICE SEMICONDUCTOR
Datasheet:
Part Number:
Description:
FPGA LatticeXP Family 10000 Cells 400MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 388-Pin FBGA Tray
Manufacturer:
LATTICE SEMICONDUCTOR
Datasheet:
Part Number:
Description:
FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 388-Pin FBGA Tray
Manufacturer:
Lattice
Datasheet:
Part Number:
Description:
IC FPGA 9.7KLUTS 188I/O 256-BGA
Manufacturer:
Lattice
Datasheet:
Part Number:
Description:
IC FPGA 9.7KLUTS 244I/O 388-BGA
Manufacturer:
Lattice
Datasheet:
Part Number:
Description:
IC FPGA 9.7KLUTS 244I/O 388-BGA
Manufacturer:
Lattice
Datasheet:
Part Number:
Description:
IC FPGA 9.7KLUTS 244I/O 388-BGA
Manufacturer:
Lattice
Datasheet: