AT24C512C-XHM-B Atmel, AT24C512C-XHM-B Datasheet - Page 20

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AT24C512C-XHM-B

Manufacturer Part Number
AT24C512C-XHM-B
Description
Manufacturer
Atmel
Datasheet

Specifications of AT24C512C-XHM-B

Lead Free Status / Rohs Status
Compliant
8720A–SEEPR–9/10
8Y6 – UDFN
Notes: 1. This drawing is for general information only. Refer to
packagedrawings@atmel.com
Package Drawing Contact:
2. Dimension b applies to metallized terminal and is
3. Soldering the large thermal pad is optional, but not
JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
measured between 0.15mm and 0.30mm from the
terminal tip. If the terminal has the optional radius on the
other end of the terminal, the dimension should not be
measured in that radius area.
recommended. No electrical connection is accomplished to
the device through this pad, so if soldered it should be tied
to ground
D
Pin 1
Index
Area
TITLE
8Y6, 8-lead, 2.0x3.0mm Body, 0.50mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package
(Sawn)(UDFN)
A3
A2
A
A1
SYMBOL
D
E
D2
E2
A
A1
A2
A3
L
e
b
1.50 REF.
e (6X)
(Unit of Measure = mm)
COMMON DIMENSIONS
1.40
0.00
0.20
0.20
D2
MIN
GPC
2.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
YNZ
NOM
1.50
0.02
0.30
0.25
Atmel AT24C512C
DRAWING NO.
1.60
1.40
0.60
0.05
0.55
0.40
0.30
MAX
8Y6
(8X)
Pin 1 ID
b
L (8X)
NOTE
2
11/21/08
REV.
E
20

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