TDA1300T NXP Semiconductors, TDA1300T Datasheet - Page 16

• Manufacturer Part Number: TDA1300T
• Manufacturer: NXP Semiconductors

Specifications of TDA1300T

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: SO
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
1997 Jul 15
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
Photodetector amplifiers and laser
supplies
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT355-1
max.
1.10
A
24
1
0.15
0.05
A
Z
1
y
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153AD
JEDEC
0.2
0.1
c
REFERENCES
D
b
7.9
7.7
0
p
(1)
13
12
E
4.5
4.3
w
(2)
M
scale
EIAJ
0.65
2.5
16
e
c
H
6.6
6.2
E
A
2
5 mm
A
1.0
L
1
0.75
0.50
L
p
TDA1300T; TDA1300TT
H
E
E
detail X
0.4
0.3
Q
PROJECTION
L
EUROPEAN
0.2
L
v
p
Q
0.13
Preliminary specification
w
A
(A )
3
0.1
X
y
v
A
ISSUE DATE
M
93-06-16
95-02-04
0.5
0.2
A
Z
(1)
SOT355-1
8
0
o
o