LH28F160BVHE-BTL90 Sharp Electronics, LH28F160BVHE-BTL90 Datasheet - Page 37

• Manufacturer Part Number: LH28F160BVHE-BTL90
• Manufacturer: Sharp Electronics

Specifications of LH28F160BVHE-BTL90

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 21/20Bit
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 2M/1M
• Supply Current: 30mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

7 Package and packing specification
SHARP
2. Markings
1. Package Outline Specification
3. Pack ing Specification
2 - 1. Marking contents
2 - 2. Marking layout
3 - 1 . Packing Materials
________________________________________---------------------------------------------------------------------------------------------------------
________________________________________----------------------------------------------------------------
________________________________________------------------------------------------------------------------------------------------------------
________________________________________---------------------------------------------------------------------------------------------------------
________________-_______________________------------------------------------------------------------------------------------------.---------------
________________________________________----------------------------------------------------------------------------------------------------.----
--_______--_____-_-------------------------------------------------------------------------------------------------------------------------------------------
(Devices shall be placed into a tray in the same direction.)
Mater i al Name
Tray
Laminated aluminum bag Aluminum polyethylene
Des i ccant
Outer case
Upper cover tray
P P band
Label
(This layout does not define the dimensions of marking character and marki ng position.)
Inner case
( 1) Product name :
(2)
(3)
(4)
Refer to drawing No. AA 1 1 4 2
Refer drawing No. AA1
Dry packing is used for the purpose of maintaining IC quality
packages on the PCB (Printed Circuit
When the epoxy resin which is used for plastic
humidity,
mount type package for a relatively
between the epoxy resin and insert material
may suddenly vaporize into steam when the entire
soldering process (e.g. VPS). This causes expansion and results
between the resin and insert material,
This dry packing is designed to prevent the above problem from occurring in
surface mount packages.
(Examp 1 e )
Company name :
Date code
“JAPAN” is marked on the package when both wafer and assembly pr
done in Japan , indicating
it may absorb 0.15% or more of its weight in moisture, If the surface
YY
(Dry packing for surface mount packages)
Material Specificaiton
Polypropylene
Conductive plastic
Conductive plastic
Silica
Card board
Paper
Card board
LH28F160BVHE-BTL90
SHARP
ww
1 4 2
gel
LHFl6Vll
the country of origin.
xxx
(500device/case)
large chip absorbs a large amount of moisture
(50devices/tray)
Board),
(3pcs/case)
and sometimes cracking of the package.
(ltray/case)
Indicates the product was manufactured
(lbag/case)
’ Denotes the product ion ref .code
Denotes the production year.
(Ol,OZ, 03,
(Lower two digit
(No marking , A , B , C )
(e.g. chip,lead
packages is stored at high
package is heated during the
________________________________________------
l
Drying of device
Drying of device
Purpose
Fixing of device
Fixing of device
Fixing of tray
Packaging of device
and date of manufacture
Outer packing of tray
Indicates part number,quantity
*
l
.
of the year.)
frame) this moisture
l
52,53)
after mounting
in separation
ocesses are
--____-----____
35
- _ _ _ _ _ _
--____