AM29DL323DB-120EI Spansion Inc., AM29DL323DB-120EI Datasheet - Page 8

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AM29DL323DB-120EI

Manufacturer Part Number
AM29DL323DB-120EI
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of AM29DL323DB-120EI

Cell Type
NOR
Density
32Mb
Access Time (max)
120ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
22/21Bit
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
3/8.5 to 9.5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
4M/2M
Supply Current
16mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29DL323DB-120EI
Manufacturer:
AMD
Quantity:
20 000
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
December 13, 2005
AM29DL322DT70R,
AM29DL322DB70R
AM29DL323DT70R,
AM29DL323DB70R
AM29DL324DT70R,
AM29DL324DB70R
AM29DL322DT90,
AM29DL322DB90
AM29DL323DT90,
AM29DL323DB90
AM29DL324DT90,
AM29DL324DB90
AM29DL322DT120,
AM29DL322DB120
AM29DL323DT120,
AM29DL323DB120
AM29DL324DT120,
AM29DL324DB120
Am29DL322D/323D/324D
Valid Combinations for TSOP Packages
Valid Combinations
T
DEVICE NUMBER/DESCRIPTION
Am29DL322D/323D/324D
EI, EIN, EE, EEN
70R
EI, EIN
E
Am29DL322D/323D/324D
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
I
OPTIONAL PROCESSING
Blank =
N
(Contact an AMD representative for more information)
TEMPERATURE RANGE
I
E
PACKAGE TYPE
E
WD
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
Valid Combinations list configurations planned to be supported in
volume for this device. Consult the local AMD sales office to con-
firm availability of specific valid combinations and to check on
newly released combinations.
AM29DL322DT70R,
AM29DL322DB70R
AM29DL323DT70R,
AM29DL323DB70R
AM29DL324DT70R,
AM29DL324DB70R
AM29DL322DT90,
AM29DL322DB90
AM29DL323DT90,
AM29DL323DB90
AM29DL324DT90,
AM29DL324DB90
AM29DL322DT120,
AM29DL322DB120
AM29DL323DT120,
AM29DL323DB120
AM29DL324DT120,
AM29DL324DB120
=
=
=
=
=
=
=
Standard Processing
16-byte ESN devices
Industrial (–40°C to +85°C)
Extended (–55°C to +125°C)
48-Pin Thin Small Outline Package
(TSOP) Standard Pinout (TS 048)
63-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 14 mm package (FBD063)
Top sector
Bottom sector
Order Number
Valid Combinations for FBGA Packages
WDEN
WDIN,
WDIN
WDE,
WDI,
WDI,
D322DT70R,
D322DB70R
D323DT70R,
D323DB70R
D324DT70R,
D324DB70R
D322DT90V,
D322DB90V
D323DT90V,
D323DB90V
D324DT90V,
D324DB90V
D322DT12V,
D322DB12V
D323DT12V,
D323DB12V
D324DT12V,
D324DB12V
Package Marking
I, E
I
7

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