AM29PL160CB-90SI AMD (ADVANCED MICRO DEVICES), AM29PL160CB-90SI Datasheet - Page 91

• Manufacturer Part Number: AM29PL160CB-90SI
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29PL160CB-90SI

• Lead Free Status / Rohs Status: Not Compliant

18.4
May 21, 2008 S29GL-A_00_A12
VBN048—48-Ball Fine-pitch Ball Grid Array (BGA) 10x 6 mm Package
PACKAGE
JEDEC
SYMBOL
SD / SE
1.00
MD
ME
D1
A1
A2
E1
φb
A
A
D
E
N
e
+0.20
-0.50
A1
0.17
0.62
0.35
MIN
10.00 mm x 6.00 mm NOM
---
10.00 BSC.
PACKAGE
6.00 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
Ø0.50
VBN 048
NONE
NOM
N/A
48
---
---
---
---
8
6
A1 ID.
SEATING PLANE
D a t a
MAX
1.00
0.73
0.45
D
---
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
NOTE
S29GL-A
A2
A
C
E
B
0.08
0.10
e
C
C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
6
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
Øb
Ø0.08
Ø0.15
e
H
M
M
C
C
G
A
B
F
E
D1
D
SD
C
7
B
A
6
5
4
3
2
1
SE
A1 CORNER
7
3425\ 16-038.25
E1
91