IBM25PPC750FL-GR0133T IBM MICROELECTRONICS, IBM25PPC750FL-GR0133T Datasheet - Page 63

• Manufacturer Part Number: IBM25PPC750FL-GR0133T
• Description: MPU 750xx RISC 32-Bit 0.13um 600MHz 1.8V/2.5V/3.3V 750-Pin CBGA Tray
• Manufacturer: IBM MICROELECTRONICS

Specifications of IBM25PPC750FL-GR0133T

• Package: 750CBGA
• Device Core: PowerPC
• Family Name: 750xx
• Number Of Cpu Cores: 1
• Data Bus Width: 32 Bit
• Maximum Speed: 600 MHz
• I/o Voltage: 1.8|2.5|3.3 V
• Operating Temperature: -40 to 105 °C

Preliminary
5.8.7 Thermal Interface and Adhesive Vendors
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
must be selected based upon high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. A partial list of vendors that advertise thermal interface materials for PowerPC
devices is shown in Table 5-9.
Table 5-9. 750FL Microprocessor Thermal Interface and Adhesive Materials Vendors
750flds60.fm.6.0
April 27, 2007
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
[phone]
http://www.dowcorning.com/content/etronics
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
[phone]
http://www.chomerics.com
Laird Technologies
4797 Detroit Avenue
Cleveland, OH 44102-2216
[phone] / [phone]
http://www.lairdtech.com
Henkel Corp - Industrial
1001 Trout Brook Crossing
Rocky Hill, CT 06067
[phone] / [phone]
http://www.loctite.com/int_henkel/loctite_us/index.cfm
AI Technology
70 Washington Road
Princeton, NJ 08550-1097
[phone]
http://www.aitechnology.com
Company Names and Addresses for Thermal Interfaces and Adhesive Materials Vendors
PowerPC 750FL RISC Microprocessor
System Design Information
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