LFSC3GA15E-6FN900C Lattice, LFSC3GA15E-6FN900C Datasheet - Page 233

• Manufacturer Part Number: LFSC3GA15E-6FN900C
• Description: IC FPGA 15.2KLUTS 900FPBGA
• Manufacturer: Lattice

Specifications of LFSC3GA15E-6FN900C

• Number Of Logic Elements/cells: *
• Number Of Labs/clbs: *
• Total Ram Bits: *
• Number Of I /o: *
• Number Of Gates: *
• Voltage - Supply: *
• Mounting Type: *
• Operating Temperature: *
• Package / Case: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

www.latticesemi.com
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
June 2008
February 2006
March 2006
June 2006
Date
Version
01.0
01.1
01.2
Pinout Information
DC and Switching
DC and Switching
Characteristics
Characteristics
Architecture
Architecture
Introduction
Introduction
Section
—
LatticeSC/M Family Data Sheet
Initial release.
SC25 1020 I/O count changed to 476.
Changed ROM 16X4 to ROM 16X2.
Changed “X2 or X4” to “DIV2 or DIV4”.
Added Global Set/Reset Section.
Added notes 5 and 6 to Recommended Operating Conditions table.
Added Power Supply Ramp Rates table.
Removed -5 and -6 speed grades from Typical Building Block Perfor-
mance table.
Added Input Delay Timing table.
Added Synchronous GSR Timing table.
Expanded PROBE_VCC and PROBE_GND description.
Removed A-RXREFCLKP_[L/R] from Signal Description table.
Added RESP_[ULC/URC] to Signal Description table.
Added notes 1 and 2 to Signal Description table.
Changed number of NCs to 28.
Changed number of SERDES (signal + power supply) to 74.
Removed RESP balls from NC list (B2, C2, B29, C29).
Added note to VTT table.
Changed RxRefclk (B2 and C2) to NC.
Added RESP_ULC.
Added RESP_URC.
Changed RxRefclk (B29 and C29) to NC.
Changed SERDES min bandwidth from 622 Mbps to 600 Mbps.
Changed max SERDES bandwidth from 3.4 Gbps to 3.8 Gbps.
Corrected number of package I/Os for the SC80 and SC115 1704 pin
packages.
Updated speed performance for typical functions with ispLEVER 6.0
values.
Changed “When these pins are not used they should be left uncon-
nected.” with “Unused VTT pins should be connected to GND if the
internal or external VCMT function is not used in the bank. If the internal
or external VCMT function for differential input termination is used, the
VTT pins should be unconnected and allowed to float.”
Added “SERDES Power Supply Sequencing Requirements” section.
Changed total bandwidth per quad from 13.6 Gbps to 15.2 Gbps.
Added the accuracy of the temperature-sensing diode to be typically +/-
10 °C. Also referred to a temperature-sensing diode application note for
more information.
Changed “CTAP” to “internal or external VCMT”.
Changed VCC12 parameter to include VDDP, VDDTX and VDDRX.
Changed typical values to match ispLEVER 6.0 Power Calculator.
7-1
Change Summary
Revision History
DS 1004 Revision History
Data Sheet DS1004