LPC1853FET256,551 NXP Semiconductors, LPC1853FET256,551 Datasheet - Page 53
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LPC1853FET256,551
Manufacturer Part Number
LPC1853FET256,551
Description
IC MCU 32BIT 512KB FLASH 256LBGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1853FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
NXP Semiconductors
9. Thermal characteristics
Table 7.
V
LPC1850_30_20_10
Objective data sheet
Symbol
T
DD
j(max)
= 2.2 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
=
T
R
P
40
amb
D
T
th(j-a)
amb
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
C unless otherwise specified;
R
th j a
Rev. 1.2 — 17 February 2011
–
j
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
LPC1850/30/20/10
DD
Typ
-
. The I/O power dissipation of
Max
<tbd>
© NXP B.V. 2011. All rights reserved.
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